Product Introduction

Process detection of module segment are: cell segment automatic detection equipment (before chip placement), cell segment automatic detection equipment (after chip placement), PCF semi-finished product automatic detection equipment (after binding), TP semi-finished product automatic detection equipment and LCM automatic detection equipment.

Inspection type

Point defects: foreign body spot, dark spot, bright spot, color spot, sky star, CG foreign body, etc.Line defects: cross line, bright line, dark line, edge line, etc.
Mura defects: red and blue spots, black shadows, horizontal and vertical stripes, etc.
Other defects: abnormal painting, light leakage, dirt, scratch and other special defects.

Specification parameters